Trace anvil system

US Sun's micro anvil system regularly grinds the surface of the anvil according to the degree of surface wear of the anvil, ensuring that the surface of the anvil is smooth. Also, this system can adjust the rotation speed of the anvil according to the degree of grinding, so the linear velocity of the anvil surface remains unchanged. Each time the 10,000 sheets of cardboard are processed by the die cutter, the anvil surface is automatically ground to 0.025 mm, and the anvil's rotation speed can be adjusted accordingly. The initialization of the grinding process is completely automated, and the initialization work is completed when the die cutter is in operation. The entire grinding work does not require the intervention of machine operators. In fact, the operator is unaware that the system is performing this function unless he/she is viewing the operating screen of the micro-anvil system.

In general, the work of the originally necessary rotating anvil pad is almost no longer needed. When the new anvil pad is mounted on the bottom roller, the operator simply starts the system, presses the "find an anvil pad" function button, and within a few minutes, the anvil pad surface is ground smooth, and The surface is a concentric circle with the bottom roller, and the rotation speed of the anvil pad is also adjusted accordingly. Even if the grinding process of the anvil mat happens during the die-cutting process, the die-cut size of the cardboard remains the same, just as before the diameter of the anvil mat began to change. The vast majority of round presses die cutters are able to use the minor anvil system for upgrades. U.S. Solar Automation can also customize this system based on machine specifications from different OEMs.